[Courtesy of LG]
LG Electronics assured tech fans worldwide that its upcoming flagship "G6" will feature an efficient heat control structure to prevent the main parts falling off the motherboard due to overheating.
"To reduce the heat, we have adopted the heat-pipe structure for the first time in our products," said an LG spokesperson. "V20, released last year, was praised for its heat control, but we reinforced the cooling-related parts because we thought keeping the smartphone's heat under control is very important."
The heat pipe is a heat transferring device in the form of a pipe normally made of copper. The pipe is filled with working fluid which circulates inside it to disperse the heat evenly and cool down the device.
This would be great news for people who were reluctant to buy LG smartphones because of their "boot loop". LG's previous smartphones were notorious for an infinite booting process. Tech fans speculate the soldering of main parts gets loose after the repeated heating and cooling process, causing the system to stutter on its startup.
LG has fixed the problem by replacing the motherboard. However, the users were left dissatisfied because it is inevitable to have all data erased during the repair process. Samsung cleared the overheating problem by adopting the heat pipe in its Galaxy S7 series.
reporter
Park Sae-jin
swatchsjp@ajunews.com
